Home » News » OMNIVISION’s OV493 Provides Streamlined and Cost-Effective Surround-View Image Processing for Mainstream Automotive Applications

OMNIVISION’s OV493 Provides Streamlined and Cost-Effective Surround-View Image Processing for Mainstream Automotive Applications

Views: 0     Author: OMNIVISION website     Publish Time: 2024-06-15      Origin: OMNIVISION website

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Dramatically Reducing the Number of Required Image Signal Processors in Surround-View Systems

SANTA CLARA, CA — May 23, 2017 — OMNIVISION Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OV493, a new companion chip that brings best-in-class surround-video image-processing capabilities to mainstream automotive applications. By processing two video streams simultaneously, the OV493 makes it possible for a system with only two ISP companion chips to process four camera inputs, enabling flexible electronic control unit (ECU) designs for surround-view applications and reducing overall system cost dramatically.

“As advanced automotive driver-assistance features, such as 360-degree surround-view systems, become more popular, automotive manufacturers seek imaging solutions that are suitable for multiple vehicle platforms and can meet stringent industry standards,” said Andy Hanvey, senior automotive marketing manager at OMNIVISION. “The OV493 gives Tier-1 OEMs an opportunity to reduce system cost, maintain high performance, and design distributed architectures for multiple driver-assistance systems.”

The OV493 is pin-to-pin compatible with the popular OV491 ISP companion chip and is designed to work seamlessly with OMNIVISION’s OV9716 and OV10640 automotive image sensors. While most ISP companion chips are located on the camera module, the OV493 can be placed on the ECU module for unprecedented flexibility in system architectures. The OV493 supports dual sensor input, each up to 1.4‑megapixels at 30 frames per second (fps) with high dynamic range (HDR).

The AEC-Q100 Grade 2-qualified companion chip comes in a compact 7 × 7 mm ball grid array (BGA) package and is currently in volume production.


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